| Spec. | Purity | Partcile Size | Available |
| Cu-UP40325 | 99.99% (4N) | -325 mesh | Not available |
| Cu-UP50325 | 99.999% (5N) | -325 mesh | Not available |
| Cu-UP60325 | 99.9999% (6N) | -325 mesh | Not available |
| Customizable | >99.9999% | Sieve as required | Not available |
| Spec. | Purity | Partcile Size | Available |
| Cu-UP40325 | 99.99% (4N) | -325 mesh | Not available |
| Cu-UP50325 | 99.999% (5N) | -325 mesh | Not available |
| Cu-UP60325 | 99.9999% (6N) | -325 mesh | Not available |
| Customizable | >99.9999% | Sieve as required | Not available |
| Application: It is mainly used for producing high purity copper sputtering targets for sputtering and coating films. | |||