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Aluminum Sputtering Target (Al)

Aluminum Sputtering Target (Al)

AvailableAluminum Sputtering Target for SaleWholesale & RetailManufacturer & SupplierFactory Supply
  • Symbol: Al
  • Purity: 99.99% - 99.9995%
  • Size: 0 - 48 inch
  • Thickness: ≥ 1 mm
  • Shape: Circular, rectangular, annular, rotary etc.
  • Ships to: Worldwide
  • Aluminum Sputtering Target List

    Product Name Shape Purity Size (inch) Thickness (mm)
    Aluminum Sputtering Target Circular 99.99% - 99.9995% 0 - 48 ≥ 1
    Aluminum Sputtering Target Rectangular 99.99% - 99.9995% 0 - 48 ≥ 1
    Aluminum Sputtering Target Annular 99.99% - 99.9995% 0 - 48 ≥ 1
    Aluminum Sputtering Target Oval 99.99% - 99.9995% 0 - 48 ≥ 1
    Aluminum Sputtering Target Cylindrical 99.99% - 99.9995% 0 - 48 ≥ 1
    Aluminum Sputtering Target Planar 99.99% - 99.9995% 0 - 48 ≥ 1
    Aluminum Sputtering Target Rotatable (rotary) 99.99% - 99.9995% 0 - 48 ≥ 1
    Note: We provide customized service. If you don't find the sputtering targets you want, please send us an email directly. We can customize it according to your requirements.

    Aluminum is a kind of silver white light metal with ductility. Aluminum is often made into rod, sheet, foil, powder, ribbon and wire. It can form an oxide film to prevent metal corrosion in humid air. Aluminum is easily soluble in dilute sulfuric acid, nitric acid, hydrochloric acid, sodium hydroxide and potassium hydroxide solutions, but not in water. The relative density of aluminum is 2.70. The melting point is 660 ℃. The boiling point is 2327 ℃.

    According to the different shapes, aluminum sputtering targets can be divided into circular, rectangular, square, annular, oval, cylindrical, planar, rotatable (rotary) aluminum targets.

    Aluminum Sputtering Target Application

    High purity aluminum sputtering target has excellent conductivity and particle minimization film. 3N5-4N5 aluminum sputtering target is mostly used for rolling aluminum foil of electrolytic capacitor, lighting and data storage. 5N-6N ultrapure aluminum sputtering targets are mostly used in semiconductor devices, optoelectronic storage media, superconducting cable stabilizing materials and space shuttle scientific research.
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